If your laser
what you expect
you need to see what
the beam looks like
The 1st of its kind
T h ey w ere see n m ostly via te m p orary storefro nt
sp aces a n d tra velin g ex hibitors.
It’s well known that:
t Beams change over time
t Focus spot shifts over power changes
t Intensity distribution changes with aging optics
See for yourself, on your laser, at your site. Call for a demo.
Here is the same beam over time
industrial ultrafast lasers by splitting the
laser beam into multiple beamlets. In many
applications, a pulse energy of a few micro-
joules is sufficient to process the material.
Current high-power ultrafast lasers have a
pulse energy of a few hundred microjoules.
Beam multiplexing can be achieved using
spatial light modulators for maximal flexibility, or fixed diffractive optical elements for
In yet another example, glass cutting is
one of the most important, yet challenging
applications for ultrafast lasers (FIGURE 4). Current technologies,
using mechanical means, have strong limitations when dealing with
thin, tempered, or multilayer glasses. Ultrafast lasers can provide
the quality needed, but usually at the expense of processing speed.
The recent development of beam shaping using non-diffractive
Bessel beams allows the creation of an elongated focus, with a
radius of a few tens of microns maintained over a length exceeding
1mm. Coupled with temporal shaping such as burst mode operation, this process has led to a variety of ways to cut thick, multilayer glasses at high speed, and is still an active field of research
The demand for greater integration in microelectronics drives the
need for advanced 3D packaging. New methods for connecting
different vertically separated layers are nec-
essary to meet this need. A thin interposer,
made of silicon and glass, perforated by mil-
lions of micro-holes provides a high connec-
tion density as well as a physical separation
between layers. To manufacture this compo-
nent, it is necessary to create multiple micro-
holes with a very high speed. Typically, holes
measuring 10–30µm diameter, with a pitch of
30 to 100µm, must be drilled in a 100µm or
less glass plate at a speed of 5000 to 10000
holes/s. Combining high-power ultrafast
lasers, beam shaping technology, and beam multiplexing with dif-
fractive optical elements will again enable significant advances in
terms of processing quality and speed.
The current generation of industrial lasers, with average power
exceeding 100W, has broken an important barrier to industrial applications by providing the potential for high-throughput processing.
However, to take full advantage of the laser source, beam engineering—that is, the shaping, functionalization, or handling of the
beam between the laser output and the workpiece—has become
an essential field of research and development. ✺
ERIC MOTTAY ( firstname.lastname@example.org) is the president and CEO of
Amplitude Systèmes, Pessac, France; www.amplitude-systemes.com. He is also a periodic contributor on ultrafast laser processing for ILS.
FIGURE 4. An example of glass cutting
with an ultrafast laser.